| 作成者 |
|
| 本文言語 |
|
| 出版者 |
|
|
|
| 発行日 |
|
| 収録物名 |
|
| 巻 |
|
| 号 |
|
| 開始ページ |
|
| 終了ページ |
|
| 出版タイプ |
|
| アクセス権 |
|
| JaLC DOI |
|
| 関連DOI |
|
|
|
|
|
| 関連URI |
|
|
|
|
|
| 関連情報 |
|
|
|
|
|
| 概要 |
Numerical simulations are conducted on heat transfer in a plate type heat spreader for bare chip cooling. The simulation is concerned with a steady state two-dimensional heat conduction problem for a ...four- and a two-layer circular plates system, which correspond to the simplified models for the [chip]-[thermal interface material A]-[heat spreader]-[thermal interface material B] system, and the [chip]-[thermal interface material] system without a heat spreader for comparison. From a series of numerical calculations, the effects of heat source and chip sizes on the maximum chip temperature T_<max> are clarified, and a simple correlation equation to predict T_<max> is proposed on the basis of the equivalent heat source radius r_<eq>.続きを見る
|
Mendeley出力
KJ00004507956