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Thermal deformations of two electronic packages, QFP (Quad Flat Package), MCM (Multi Chip Module), were measured by moir'e interferometry. A thermal loading was conducted by cooling the packages from ...an elevated temperature 100$^circ$C to room temperature 25$^circ$C. Moir'e fringes were obtained on the cross sections of the packages to clarify the effect of the CTE (Coefficient of Thermal Expansion) mismatch of the micro components, such as silicon, metal and resin. The experiments were also made using QFP mounted on the PCB (Printed Circuit Board) to examine the influence of the PCB. FEA (Finite Element Analysis) was also performed to simulate the thermal deformations of the packages.続きを見る
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Mendeley出力
