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In order to evaluate strength reliability of micron size polycrystalline silicon (poly-Si) structure for microelectromechanical systems (MEMS), bending strength tests of cantilever beam, Weibull analy...sis of the strength and fracture surface analysis are performed. Recently, the importance of MEMS in society is increasing, and the number of production is also increasing. MEMS devices, which contain mechanical movement, have to maintain their reliability in face of external shock, thermal stress and residual stress from manufacturing processes. When the age of the MEMS mass production comes, in case the material strength design of MEMS is performed, required strength data is not average value but the variation, especially minimum value assumed of the structure and material. Then, in order to evaluate strength reliability of micron size poly-Si structure, tests and analysis are performed. The specimen is made by chemical vapor deposition (CVD) process and the thickness is 3.5, 6.4 and 8.3 [μm] and the specimen has notch (stress concentration). The test specimen used for the test changed characteristics of (1) film thickness (2) stress concentration, and investigation about the influence each effect of the variation in a bending strength with fracture surface analysis are discussed.続きを見る
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