Theoretical Study of Adhesive Interfaces between Epoxy Resin and Metal Surface in Semiconductor Packages - Collections

＜Doctoral Thesis＞
Theoretical Study of Adhesive Interfaces between Epoxy Resin and Metal Surface in Semiconductor Packages

	Theoretical Study of Adhesive Interfaces between Epoxy Resin and Metal Surface in Semiconductor Packages
Creator	Creator Name 鶴見, 直明 TSURUMI, Naoaki ツルミ, ナオアキ
Examiner	吉澤, 一成
	田中, 賢
	田中, 敬二
Language	English
Academic Year Conferred	2021
Conferring University	九州大学
Conferring University	Kyushu University
Degree	DOCTOR OF ENGINEERING
Degree Type	Doctoral Degree
Access Rights	metadata only access

File	FileType	Size	Views	Description
eng3119_abstract	pdf	640 KB	309	要旨
eng3119_review	pdf	217 KB	235	審査結果要旨

Record ID	4496031
Peer-Reviewed	Refereed
Rights	やむを得ない事由により本文ファイル非公開 (3)
Rights	Public access to the fulltext file is restricted for unavoidable reason (3)
Report Number	17102甲第15730号
Number of Diploma	工博甲第3119号
Granted Date	2021-09-24
Date Accepted	2021-07-29
Faculty	工博
Location	SciTech
Location	学位論文書庫【閉架】
Location	Closed Stacks
Call Number	工博/甲/3119
Notes	主1
Created Date	2021.11.02
Modified Date	2022.01.05