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Thermal management is one of the main concerns in three-dimensional integration due to difficulty of dissipating heat through the stack of the integrated circuit. In a 3D stack involving a data-path a...ccelerator, a base processor and memory components, peak temperature reduction is targeted in this paper. A mapping algorithm has been devised in order to distribute operations of data flow graphs evenly over the processing elements of the target accelerator in two steps involving thermal-aware partitioning of input data flow graphs, and thermal-aware mapping of the partitions onto the processing elements. The efficiency of the proposed technique in reducing peak temperature is demonstrated throughout the experiments.続きを見る
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Mendeley出力
farhad11_3