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Nowadays, reducing the amount of the used slurry waste is extremely important from an ecological point of view. Chemical mechanical polishing (CMP) slurry reuse enables us to drastically reduce the co...st and waste of slurry. Many researches have studied on the reuse of conventional slurry [1, 2, 3, 4]. As the removal rate of the conventional slurry strongly depends on the solid concentration and the pH, the conventional slurry must be severely controlled during the reuse of slurry [1, 4, 5]. This makes it difficult to reuse the conventional slurry in manufacturing. In our prior work, we reported that Mn2O3 slurry can polish SiO2 film, while offering a high removal rate and the realization of pad-conditioning-free polish [6]. In this paper, we have studied on the reuse of Mn2O3 slurry by circulating slurry.続きを見る
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